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SEMICONDUCTOR DEVICES
Insulating cells
IGBT & SFRD modules
Diode-thyristor modules
Thyristors
Symmetric thyristors (Triacs)
Pulsed power light triggered thyristors (LTT)
Rotor devices
Diodes
Silicon surge voltage suppressors
Heatsinks
Air cooling heatsinks for stud devices
Air cooling heatsinks for press pack devices
Air cooling heatsinks for power module
High efficiency heatsinks for power module
Fluid cooling heatsinks for stud devices
Fluid cooling heatsinks for press pack devices
Fluid cooling heatsinks for power modules
Clamping systems for press pack diodes and thyristors
Insulated cell
INSULATION ELEMENTS

Features and application fields:

▪ Insulation elements are designed for insulation of press pack devices from cooling systems, allowing to place some devices on the same heatsink and to simplify converter design
▪ Optimum design for low thermal resistance
▪ Plastic housing, heat conductive insulation AlN


Type Overall dimensions, mm w,
g
Thermal resistance (insulation material) ,
ºC/W
F,
kN
Visol(effective value),
kV
IT40 1780 195 0.075 13÷16 10
IT60 17116136 490 0.075 24÷28 10


PJSC Electrovipryamitel
430001, Russia,
Rep. Mordovia, Saransk,
Proletarskaya Str., 126
Ph./Fax.(8342) 47-04-30
(8342) 47-15-01
E-mail: vpruvs@elvpr.ru


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