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SEMICONDUCTOR DEVICES
Heatsinks
IGBT & SFRD modules
Diode-thyristor modules
Thyristors
Symmetric thyristors (Triacs)
Pulsed power light triggered thyristors (LTT)
Rotor devices
Diodes
Silicon surge voltage suppressors
Heatsinks
Air cooling heatsinks for stud devices
Air cooling heatsinks for press pack devices
Air cooling heatsinks for power module
High efficiency heatsinks for power module
Fluid cooling heatsinks for stud devices
Fluid cooling heatsinks for press pack devices
Fluid cooling heatsinks for power modules
Clamping systems for press pack diodes and thyristors
Insulated cell
CLAMPING SYSTEMS FOR PRESS PACK DIODES AND THYRISTORS
 
  • For pressing of press pack devices with contact surface diameters from 19 mm up to 100 mm with air and water heatsinks

 

Type B H w F Visol Outlines
mm mm mm g kN kV
123 72 44 92 230 4÷8 5  
103

98

50 135 330 10÷17 5  
104 98 70 145 340 10÷17 5
243

116

70 120 420 9÷17 5  
153

116

76 127 660 20÷28 5
106 116 80 180 2320 20÷28 5
107 144 76 210 5500 48  5  
109 170 85 245 8300 80 5


PJSC Electrovipryamitel
430001, Russia,
Rep. Mordovia, Saransk,
Proletarskaya Str., 126
Ph./Fax.(8342) 47-04-30
(8342) 47-15-01
E-mail: vpruvs@elvpr.ru


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