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SEMICONDUCTOR DEVICES
Heatsinks
IGBT & SFRD modules
Diode-thyristor modules
Thyristors
Symmetric thyristors (Triacs)
Pulsed power light triggered thyristors (LTT)
Rotor devices
Diodes
Silicon surge voltage suppressors
Heatsinks
Air cooling heatsinks for stud devices
Air cooling heatsinks for press pack devices
Air cooling heatsinks for power module
High efficiency heatsinks for power module
Fluid cooling heatsinks for stud devices
Fluid cooling heatsinks for press pack devices
Fluid cooling heatsinks for power modules
Clamping systems for press pack diodes and thyristors
Insulated cell
FLUID COOLING HEATSINKS FOR POWER MODULES

  • Heatsinks OB15, OB16 are designed for water/fluid cooling of diode/thyristor modules with base plate width 20, 34, 50 mm 
  • Heatsinks OB17, OB18 are designed for water/fluid cooling of high power IGBT modules with base plates 130140 mm and 140190 mm


Short parameters:

Type Cross
section
view
w Rthha ΔPh Heatsink material
(water flow rate 3 l/min) (water flow rate 3 l/min)
g ˚/W Pa
OB15 250 0.065 10000 Copper
OB16 300 0.060 10000 Copper
OB17 1400 0.022 7000 Aluminium
OB18 2000 0.019 7000 Aluminium
OB27 4700 0.010 18300 Copper


PJSC Electrovipryamitel
430001, Russia,
Rep. Mordovia, Saransk,
Proletarskaya Str., 126
Ph./Fax.(8342) 47-04-30
(8342) 47-15-01
E-mail: vpruvs@elvpr.ru


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